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EEV13 Parameters with UltraDAS + SDSU Gen.2


NB these figures refer to EEV13 when it was used with a Gen. 2 controller. Converted to Gen. 3 on the 13th Feb. 2007


Device Identification


 
Chip name  EEV13
Year of manufacture 1999
Serial number 7061-8-3
First light on La Palma  July 2001
Description EEV-4280 thinned and AR coated 

Operational Characteristics

Speed 
Slow
Fast
Bias(ADU)
1060
870 
Gain(e/ADU)
 1.16
2.3 
Noise(e)
 3.6
5.4 

Noise (ADU)

3.1

2.4

Linear to (ADU)
+/-1.2% to 60K 
+/-0.5% to 60K 
Readout time (s)
55 
37 
Binning

All binning modes up to 5 x 2 have been tested with no increase in noise.

Linearity measured on the 2nd January 2002 using this method


Vertical CTE  0.999994
Horizontal CTE  0.9999974

Physical Characteristics

X Pixel size 13.5 microns
Y Pixel size  13.5 microns 
X size in pixels of digitised area  2148
Y size in pixels of digitised area 4200
X size of useful imaging area 2048
Y size of useful imaging area 4100
X start of useful imaging area 51
Y start of useful imaging area 0
LN2 capacity of cryostat 2.5 litres
Cryostat window thickness 4 mm
Distance from window to CCD 10.4 mm measured optically 
Cryostat window size 36 x 66 mm

Operational Parameters

Operating temperature  153K
Preferred amplifier R

Measured Characteristics

Quantum Efficiency

Full QE curve for EEV4280 in tabulated form, measured at ATC March 99
 
 
 
Dark current  none measureable @153K
Full well bloom limit 240,000 electrons
Chip flatness
Cosmetics
 

 

Using RHS amplifier black columns at 1079, 1080, 1674, 1675, 1676, 1764, 1765, 1766, 1767
See Dark Frame and Flat Field
Cosmic Ray count ~2000 events/chip/hour
Fringing. See the graph below of fringe amplitude vs wavelength for an EEV.



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Last modified: 21 November 2010