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After manufacture, by Loral, the wafers are probe-tested by Loral. This yields an image of a test pattern, taken at room temperature, at high light level. Hard copies are provided. Poor devices are rejected at this stage. good devices would be selected for immediate packaging, or reserved for thinning and packaging.
A good device would only have a few defective columns (maybe ), and a limited number of obvious traps (); in general these remain when the device is cooled. From a batch of 20 wafers, with 4 chips/wafer, they hope to get good devices.
It is only after packaging, and cold testing that the low-level performance can be known. This is also true of devices that are thinned and then mounted in a package (by Lesser).